Hot sell ZX-C1 bga rework machine,bga chip repair

Related Categories:Other Welding Equipment

Product Detailed

ZX-C1 bga chip repair machine
1.Three independent heater
2.easy to operate
3.Suitable for laptop,pc,mobile,xbox360,ps3,ipad

ZX-C1 bga chip repair machine

Features:
1. With controller and button to control the machine manual. Adjust height of top heater by hand, with vacuum pen to pick BGA manual after reflow.

2. Top and bottom heater use hot air, 3rd heater use IR to preheat whole PCB board. Bottom heater can adjust up and down to support the bottom of BGA.

3. Top and bottom heater can set 8 segments heating, cooling and constant temperature, save 10 groups temperature profile. IR heater start heating at the same time with top and bottom heater.

4. Three heater use independent PID control, heating process is more accurate and uniform.

5. Bottom heater equipped with support, can adjust up and down to support bottom side of PCB board to prevent deformation.

6. There is support on top of IR heater to prevent PCB deformation.

7. Cross-flow fan to cool PCB board after remove and reflow to ensure welding effect.

SPECIFICATION

PCB Size	≤L540×W450mm
PCB Thickness	0.1~5mm
Temperature Control	K thermocouple PID Closed loop
PCB Positioning mode	Outer
Bottom preheat	Infrared 1800W
Main (Top+bottom) heater	Hot air 800W+800W
Power supply	Single phase 220V,50/60Hz,3.6KVA
Dimension	L570×W560×H560mm
Weight	Approx. 34kgs