Shenzhen Zhenxun Technology Co., Ltd.

ZX-CP300 easy operate lowe cost motherboard laptop bga rework station desoldering tool

ZX-CP300 easy operate lowe cost motherboard laptop bga rework station desoldering tool
Product Detailed

ZX-CP300 desoldering tool
Touch screen control
IR and hot air
Three independent heater
pick and place bga IC

 ZX-CP300 desoldering tool,BGA rework station

Features:

 1. With PLC user interface control, display actual temperature of three zone and a test temperature curve;

2. With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;

3. Three heater with 9 segment temperature up (down)+9 segment constant temperature control, can store 40 groups temperature curve;

4. Three heating zone with independent PID to control heating process, more stable and accurate;

5. Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;

6. After removal and welding with cooling fan to cool PCB board, ensure welding effect;

7. Temperature profile parameter with password protection;

8. Equipped with a variety size of hot-air nozzle, or made according to special requirements;

9. Build-in vacuum pump, no need gas sources.

 

 

SPECIFICATION

PCB Size

≤L350×W320mm

PCB Thickness

0.1~5mm

Temperature Control

K thermocouple  PID Closed loop

PCB Positioning mode

Outer

Bottom preheat

Infrared  2400W

Main (Top+bottom) heater

Hot air  800W+800W

Power supply

Single phase  220V,50/60Hz,4.0KVA

Dimension

L560×W570×H570mm

Weight

Approx. 38kgs



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